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North America Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding

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Sep 2022 - 103 Pages - From $2,600
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North America advanced IC substrates market is projected to grow by 6.6% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. 
Highlighted with 23 tables and 46 figures, this 103-page report “North America Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire North America advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
 
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure 
• Growth Drivers 
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. 
 
Based on Packaging Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. 
• FC BGA
• FC CSP
• Other Packaging Types
 
Based on Material Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. 
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
 
By Manufacturing Method, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. 
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
 
By Bonding Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. 
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
 
By Application, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. 
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
 
Geographically, the following national/local markets are fully investigated:
• U.S.
• Canada
• Mexico
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included.
 
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players: 
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor 
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
 
1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 25
2.2 Major Growth Drivers 27
2.3 Market Restraints and Challenges 32
2.4 Emerging Opportunities and Market Trends 35
2.5 Porter’s Fiver Forces Analysis 39
3 Segmentation of North America Market by Packaging Type 43
3.1 Market Overview by Packaging Type 43
3.2 FC BGA 45
3.3 FC CSP 46
3.4 Other Packaging Types 47
4 Segmentation of North America Market by Material Type 48
4.1 Market Overview by Material Type 48
4.2 Rigid Integrated Circuit Substrate 50
4.3 Flex Integrated Circuit Substrate 51
4.4 Ceramic Integrated Circuit Substrate 52
5 Segmentation of North America Market by Manufacturing Method 53
5.1 Market Overview by Manufacturing Method 53
5.2 Subtraction Process (SP) 55
5.3 Addition Process (AP) 56
5.4 Modified Semi-additive Process (MSAP) 57
6 Segmentation of North America Market by Bonding Technology 58
6.1 Market Overview by Bonding Technology 58
6.2 Wire Bonding 60
6.3 FC Bonding 62
6.4 Tape Automated Bonding (TAB) 64
7 Segmentation of North America Market by Application 65
7.1 Market Overview by Application 65
7.2 Mobile and Consumer Electronics 67
7.3 Automotive and Transportation 68
7.4 IT and Telecom 69
7.5 Other Applications 70
8 North America Market 2021-2031 by Country 71
8.1 Overview of North America Market 71
8.2 U.S. 74
8.3 Canada 77
8.4 Mexico 79
9 Competitive Landscape 81
9.1 Overview of Key Vendors 81
9.2 New Product Launch, Partnership, Investment, and M&A 84
9.3 Company Profiles 85
ASE Group 85
AT&S Austria Technologie & Systemtechnik AG 87
Fujitsu Ltd. 88
IBIDEN Co., Ltd. 89
Kinsus Interconnect Technology Corp. 90
Korea Circuit Co., Ltd. 91
KYOCERA Corporation 92
LG Innotek Co., Ltd. 93
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 94
Shenzhen Fastprint Circuit Tech 95
Shinko Electric Industries Co., Ltd. 96
Siliconware Precision Industries Co., Ltd. 97
STATS ChipPAC Pte. Ltd. 98
TTM Technologies Inc. 99
Unimicron Corporation 100
Zhen Ding Technology Holding Ltd. 101
Zhuhai ACCESS Semiconductor 102
RELATED REPORTS 103
List of Tables:
 
Table 1.  Snapshot of North America Advanced IC Substrates Market in Balanced Perspective, 2021-2031 17
Table 2. World Economic Outlook, 2021-2031 22
Table 3. World Economic Outlook, 2021-2023 23
Table 4. World Semiconductor Market, 2021-2031, $ bn 30
Table 5.  Main Product Trends and Market Opportunities in North America Advanced IC Substrates Market 35
Table 6. North America Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 43
Table 7. North America Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 48
Table 8. North America Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 53
Table 9. North America Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 58
Table 10. North America Advanced IC Substrates Market by Application, 2021-2031, $ mn 65
Table 11. North America Advanced IC Substrates Market by Country, 2021-2031, $ mn 72
Table 12. U.S. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 76
Table 13. U.S. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 76
Table 14. U.S. Advanced IC Substrates Market by Application, 2021-2031, $ mn 76
Table 15. Canada Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 78
Table 16. Canada Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 78
Table 17. Canada Advanced IC Substrates Market by Application, 2021-2031, $ mn 78
Table 18. Mexico Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 80
Table 19. Mexico Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 80
Table 20. Mexico Advanced IC Substrates Market by Application, 2021-2031, $ mn 80
Table 21. ASE Group: Company Snapshot 85
Table 22. ASE Group: Business Segmentation 86
Table 23. ASE Group: Product Portfolio 86
 
 
 
 
List of Figures:
 
Figure 1. Research Method Flow Chart 11
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 14
Figure 3. North America Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 16
Figure 4. Industry Value Chain Analysis 19
Figure 5. North America Advanced IC Substrates Market, 2021-2031, $ mn 20
Figure 6. Impact of COVID-19 on Business 25
Figure 7. Primary Drivers and Impact Factors of North America Advanced IC Substrates Market 27
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn 31
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn 31
Figure 10. Primary Restraints and Impact Factors of North America Advanced IC Substrates Market 32
Figure 11. Investment Opportunity Analysis 36
Figure 12. Porter’s Fiver Forces Analysis of North America Advanced IC Substrates Market 39
Figure 13. Breakdown of North America Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue 44
Figure 14. North America Addressable Market Cap in 2022-2031 by Packaging Type, Value ($ mn) and Share (%) 44
Figure 15. North America Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn 45
Figure 16. North America Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn 46
Figure 17. North America Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn 47
Figure 18. Breakdown of North America Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue 49
Figure 19. North America Addressable Market Cap in 2022-2031 by Material Type, Value ($ mn) and Share (%) 49
Figure 20. North America Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn 50
Figure 21. North America Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn 51
Figure 22. North America Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn 52
Figure 23. Breakdown of North America Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue 54
Figure 24. North America Addressable Market Cap in 2022-2031 by Manufacturing Method, Value ($ mn) and Share (%) 54
Figure 25. North America Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn 55
Figure 26. North America Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn 56
Figure 27. North America Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn 57
Figure 28. Breakdown of North America Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue 59
Figure 29. North America Addressable Market Cap in 2022-2031 by Bonding Technology, Value ($ mn) and Share (%) 59
Figure 30. North America Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn 60
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package 61
Figure 32. North America Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn 62
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate 63
Figure 34. North America Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn 64
Figure 35. Breakdown of North America Advanced IC Substrates Market by Application, 2021-2031, % of Revenue 66
Figure 36. North America Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%) 66
Figure 37. North America Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn 67
Figure 38. North America Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn 68
Figure 39. North America Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn 69
Figure 40. North America Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn 70
Figure 41. Breakdown of North America Advanced IC Substrates Market by Country, 2021 and 2031, % of Revenue 72
Figure 42. Contribution to North America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 73
Figure 43. U.S. Advanced IC Substrates Market, 2021-2031, $ mn 75
Figure 44. Canada Advanced IC Substrates Market, 2021-2031, $ mn 77
Figure 45.  Advanced IC Substrates Market in Mexico, 2021-2031, $ mn 79
Figure 46. Growth Stage of North America Advanced IC Substrates Industry over the Forecast Period 81
 
 
 

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